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MediaTek is entering a crowded middle-class market with Dimensity 6300, a new chipset designed for the next wave of affordable 5G smartphones.
The chip is manufactured using a 6nm process and offers a slight upgrade over its predecessor, Dimension 6100+. MediaTek says CPU performance has increased by 10% thanks to two faster Cortex-A76 cores clocked at 2,4GHz. The remaining six Cortex-A55 cores with a clock frequency of 2 GHz. Graphics are handled by the Mali-G57 MC2 GPU, a familiar choice at this level.
There is also a built-in 5G modem compatible with the 3GPP Release 16 standard. MediaTek's claims of improved energy efficiency thanks to UltraSave 3.0+ technology deserve more attention. The company suggests that users can expect a 13-30% improvement over competitors in connectivity up to 6GHz 5G.
In addition, the Dimensity 6300 supports Full HD+ displays with a refresh rate of 120 Hz. Camera capabilities are also average, with support for up to 108MP sensors and dual 16MP configurations. Connectivity options include Bluetooth 5.2 and dual-band Wi-Fi 5 (a/b/g/n/ac), but storage remains limited to UFS 2.2 and RAM to LPDDR4x.
The first smartphone confirmed to use Dimensity 6300 is the Realme C65 5G, which is expected to launch later this month. With MediaTek leading the way, we can expect more manufacturers to release similar devices in an effort to offer affordable 5G connectivity. While not revolutionary, the Dimensity 6300 is a step forward in making 5G accessible to a wider audience.
